METHOD FOR MEASURING THREE-DIMENSIONAL SHAPE
PURPOSE: A 3D shape measuring method for producing height data having the reliability of a solder ball is provided to measure the height of the solder ball by using phase values by extracting the phase value on the substrate in which the sinusoidal wave pattern. CONSTITUTION: A phase value of a sine...
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| Main Authors | , |
|---|---|
| Format | Patent |
| Language | English Korean |
| Published |
30.11.2010
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| Subjects | |
| Online Access | Get full text |
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| Abstract | PURPOSE: A 3D shape measuring method for producing height data having the reliability of a solder ball is provided to measure the height of the solder ball by using phase values by extracting the phase value on the substrate in which the sinusoidal wave pattern. CONSTITUTION: A phase value of a sine wave pattern is reflected is extracted in the central part of the solder ball. The extracted phase value is determined the phase value of the central part of the solder ball(S130). In the substrate located on surface the reference line, the phase value of a part in which the sinusoidal wave pattern is reflected is extracted. The extracted phase value is determined as the phase value of substrate. |
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| AbstractList | PURPOSE: A 3D shape measuring method for producing height data having the reliability of a solder ball is provided to measure the height of the solder ball by using phase values by extracting the phase value on the substrate in which the sinusoidal wave pattern. CONSTITUTION: A phase value of a sine wave pattern is reflected is extracted in the central part of the solder ball. The extracted phase value is determined the phase value of the central part of the solder ball(S130). In the substrate located on surface the reference line, the phase value of a part in which the sinusoidal wave pattern is reflected is extracted. The extracted phase value is determined as the phase value of substrate. |
| Author | AHN, WOO JUNG PAHK, HEUI JAE |
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| RelatedCompanies | SNU PRECISION CO.,LTD |
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| Snippet | PURPOSE: A 3D shape measuring method for producing height data having the reliability of a solder ball is provided to measure the height of the solder ball by... |
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| SubjectTerms | MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING |
| Title | METHOD FOR MEASURING THREE-DIMENSIONAL SHAPE |
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