METHOD FOR MEASURING THREE-DIMENSIONAL SHAPE

PURPOSE: A 3D shape measuring method for producing height data having the reliability of a solder ball is provided to measure the height of the solder ball by using phase values by extracting the phase value on the substrate in which the sinusoidal wave pattern. CONSTITUTION: A phase value of a sine...

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Bibliographic Details
Main Authors AHN, WOO JUNG, PAHK, HEUI JAE
Format Patent
LanguageEnglish
Korean
Published 30.11.2010
Subjects
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Summary:PURPOSE: A 3D shape measuring method for producing height data having the reliability of a solder ball is provided to measure the height of the solder ball by using phase values by extracting the phase value on the substrate in which the sinusoidal wave pattern. CONSTITUTION: A phase value of a sine wave pattern is reflected is extracted in the central part of the solder ball. The extracted phase value is determined the phase value of the central part of the solder ball(S130). In the substrate located on surface the reference line, the phase value of a part in which the sinusoidal wave pattern is reflected is extracted. The extracted phase value is determined as the phase value of substrate.
Bibliography:Application Number: KR20090043836