METHOD FOR PRODUCING ELECTRIC CONTACTS ON A SEMICONDUCTOR COMPONENT

PURPOSE: A method for manufacturing an electric contact on a semiconductor device is provided to improve corrosion resistance against acid medium. CONSTITUTION: Damp materials to form contacts are provided to at least one outer surface of a semiconductor device with a preset stripe and/or point. The...

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Bibliographic Details
Main Authors FRANKE DIETER, SCHMIDT WILFRIED, SCHWIRTLICH INGO, NAGEL HENNING
Format Patent
LanguageEnglish
Korean
Published 29.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A method for manufacturing an electric contact on a semiconductor device is provided to improve corrosion resistance against acid medium. CONSTITUTION: Damp materials to form contacts are provided to at least one outer surface of a semiconductor device with a preset stripe and/or point. The wet materials are dried by heating the semiconductor device at a temperature of T1 and the semiconductor device is maintained at the temperature of T1 for t1. The dried materials are sintered by heating the semiconductor device at a temperature of T2 and the semiconductor device is maintained at the temperature of T2. The semiconductor device is cooled at a room temperature or temperature of T3 and is maintained at the temperature of T3 for t3.
Bibliography:Application Number: KR20100046937