METHOD FOR PRODUCING ELECTRIC CONTACTS ON A SEMICONDUCTOR COMPONENT
PURPOSE: A method for manufacturing an electric contact on a semiconductor device is provided to improve corrosion resistance against acid medium. CONSTITUTION: Damp materials to form contacts are provided to at least one outer surface of a semiconductor device with a preset stripe and/or point. The...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
29.11.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A method for manufacturing an electric contact on a semiconductor device is provided to improve corrosion resistance against acid medium. CONSTITUTION: Damp materials to form contacts are provided to at least one outer surface of a semiconductor device with a preset stripe and/or point. The wet materials are dried by heating the semiconductor device at a temperature of T1 and the semiconductor device is maintained at the temperature of T1 for t1. The dried materials are sintered by heating the semiconductor device at a temperature of T2 and the semiconductor device is maintained at the temperature of T2. The semiconductor device is cooled at a room temperature or temperature of T3 and is maintained at the temperature of T3 for t3. |
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Bibliography: | Application Number: KR20100046937 |