METHOD FOR FLEXIBLE ITO TREATING SUBSTRATES

PURPOSE: A flexible ITO substrate processing method is provided to improve the property of a flexible display device by effectively removing the moisture and impurities included in an ITO substrate within a short time. CONSTITUTION: A flexible substrate(10) is plasma-cured in the oxygen atmosphere....

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Bibliographic Details
Main Authors SONG, KAP DUK, KIM, KYONG MIN, KOO, SONG REEM
Format Patent
LanguageEnglish
Korean
Published 26.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A flexible ITO substrate processing method is provided to improve the property of a flexible display device by effectively removing the moisture and impurities included in an ITO substrate within a short time. CONSTITUTION: A flexible substrate(10) is plasma-cured in the oxygen atmosphere. The oxygen gas used for the oxygen atmosphere is a one among O2, O3, and N2O. An ITO layer is formed by depositing it using the high frequency in 1KW~10KW, oxygen, and argon gas on the upper ITO target of the flexible substrate. The pressure of a furnace is 0.1torr~3torr. The heating temperature is 25°C~100°C.
Bibliography:Application Number: KR20090043042