INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REINFORCED ENCAPSULANT HAVING EMBEDDED INTERCONNECT AND METHOD OF MANUFACTURE THEREOF

PURPOSE: An integrated circuit packaging system and a manufacturing method thereof are provided to reduce costs, to simplify a system, and to improve functions. CONSTITUTION: A base package substrate(102) comprises a component side and a system side. An integrated circuit storing part(120) is formed...

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Bibliographic Details
Main Authors KUAN HEAP HOE, SHIM, IL KWON, KIM, YOUNG CHEOL, CHOW SENG GUAN
Format Patent
LanguageEnglish
Korean
Published 24.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: An integrated circuit packaging system and a manufacturing method thereof are provided to reduce costs, to simplify a system, and to improve functions. CONSTITUTION: A base package substrate(102) comprises a component side and a system side. An integrated circuit storing part(120) is formed so that a part of a laminated interconnection part is exposed by a reinforcement rod part molded in a component side. A reinforcement rod part(116) is molded in the component side. The reinforcement rod part comprises the thickness ranges from 30% to 90% compared to the entire height of the laminated rod part.
Bibliography:Application Number: KR20100046047