INTEGRATED CIRCUIT PACKAGING SYSTEM WITH REINFORCED ENCAPSULANT HAVING EMBEDDED INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
PURPOSE: An integrated circuit packaging system and a manufacturing method thereof are provided to reduce costs, to simplify a system, and to improve functions. CONSTITUTION: A base package substrate(102) comprises a component side and a system side. An integrated circuit storing part(120) is formed...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English Korean |
Published |
24.11.2010
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PURPOSE: An integrated circuit packaging system and a manufacturing method thereof are provided to reduce costs, to simplify a system, and to improve functions. CONSTITUTION: A base package substrate(102) comprises a component side and a system side. An integrated circuit storing part(120) is formed so that a part of a laminated interconnection part is exposed by a reinforcement rod part molded in a component side. A reinforcement rod part(116) is molded in the component side. The reinforcement rod part comprises the thickness ranges from 30% to 90% compared to the entire height of the laminated rod part. |
---|---|
Bibliography: | Application Number: KR20100046047 |