CONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING USING THE SAME, AND SEMICONDUCTOR DEVICE BONDED BY THE SAME

PURPOSE: A conductive junction material, a junction method, and a semiconductor device using the same are provided to secure the high heat resistant property and the high heat radiating property of a junction part by performing a pressureless junction process without an adhesive. CONSTITUTION: A con...

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Bibliographic Details
Main Authors YASUDA YUUSUKE, INADA TEIICHI, MORITA TOSHIAKI, IDE EIICHI
Format Patent
LanguageEnglish
Korean
Published 05.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
CASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
PERFORMING OPERATIONS
POWDER METALLURGY
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING METALLIC POWDER
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Summary:PURPOSE: A conductive junction material, a junction method, and a semiconductor device using the same are provided to secure the high heat resistant property and the high heat radiating property of a junction part by performing a pressureless junction process without an adhesive. CONSTITUTION: A conductive junction material is arranged between junction units(201). The conductive junction material includes a silver oxide particle(202), silver flake(203), and a dispersing agent. The dispersing agent includes an organic compound with 30 or less carbon numbers. The conductive junction material is heated to be sintered in order to form a sintered silver layer(205). The sintered silver layer is bonded with the junction interface of the junction units by a metallic bond.
Bibliography:Application Number: KR20100038827