GLOBAL PLANARIZATON FOR AN ELECTRODE OF A CONTACT-TYPE CAPACITIVE SENSOR

PURPOSE: A global planarization method for electrode of contact-type capacitive sensor, which flattens an electrode pattern, in which metal is filled, toward a substrate of a non-metallic material is provided to reduce signal noise by pattern collision. CONSTITUTION: A global planarization method fo...

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Bibliographic Details
Main Authors KANG, DAE SIL, MOON, WON KYU
Format Patent
LanguageEnglish
Korean
Published 04.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PURPOSE: A global planarization method for electrode of contact-type capacitive sensor, which flattens an electrode pattern, in which metal is filled, toward a substrate of a non-metallic material is provided to reduce signal noise by pattern collision. CONSTITUTION: A global planarization method for electrode of contact-type capacitive sensor is as follows. Each substrate(100) of a moving element and a fixed element is etched in fixed shape. An electrode material(200) is filled in the etched place. CMP is performed until the filled electrode material has fixed depth. A coating layer is evaporated on the formed electrode. The substrate is composed of a glass wafer. The electrode material is made of chrome.
Bibliography:Application Number: KR20090036498