MODIFIER FOR REACTIVE HOT MELT ADHESIVE AND REACTIVE HOT MELT ADHESIVE CONTAINING THAT

PURPOSE: A modifier for a reactive hot melt adhesive, and the reactive hot melt adhesive including thereof are provided to secure the initial adhesive force and the coherence strength between non-polar materials, and to prevent the generation of volatile organic compounds. CONSTITUTION: A modifier f...

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Main Authors KIM, TAE KYOON, JEONG, HAN MO, LEE, SANG YUN, JEONG, KIE YOUN, KIM, CHEOL WOO, CHO, YANG LAE, YUN, MI JUNG, CHO, YOUN BOK
Format Patent
LanguageEnglish
Korean
Published 03.11.2010
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Summary:PURPOSE: A modifier for a reactive hot melt adhesive, and the reactive hot melt adhesive including thereof are provided to secure the initial adhesive force and the coherence strength between non-polar materials, and to prevent the generation of volatile organic compounds. CONSTITUTION: A modifier for a reactive hot melt adhesive contains a multi-block copolymer. The multi-block copolymer is obtained by polymerizing a polymer initiator having a hydrophilic segment formed by condense-polymerizing a hydrophilic polymer and 4,4`-azobis(4-cyanopentanoic acid), layered silicate, a vinyl monomer, and a chain transfer agent.
Bibliography:Application Number: KR20090035788