SOLUTION PROCESSED ELECTRONIC DEVICES

There is provided a process for forming an organic electronic device. The process includes the steps of providing a TFT substrate; forming a thick organic planarization layer over the substrate; forming on the planarization layer a multiplicity of thin first electrode structures having a first thick...

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Bibliographic Details
Main Authors TSAI YAW MING A, STAINER MATTHEW
Format Patent
LanguageEnglish
Korean
Published 01.10.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:There is provided a process for forming an organic electronic device. The process includes the steps of providing a TFT substrate; forming a thick organic planarization layer over the substrate; forming on the planarization layer a multiplicity of thin first electrode structures having a first thickness, where the electrode structures have tapered edges with a taper angle of no greater than 75°; forming a buffer layer by liquid deposition of a composition including a buffer material in a first liquid medium, the buffer layer having a second thickness, wherein the second thickness is at least 20% greater than the first thickness; forming over the buffer layer a chemical containment pattern defining pixel openings; depositing into at least a portion of the pixel openings a composition including a first active material in a second liquid medium; and forming a second electrode.
Bibliography:Application Number: KR20107010640