STRUCTURE FOR MULTI-ROW LEAD FRAME AND SEMICONDUCTOR PACKAGE THEREOF AND MANUFACTURE METHOD THEREOF

PURPOSE: The manufacturing method of multi-row lead frame and semiconductor package using the same minimizes the plating thickness at the plating pattern. The slimming of the semiconductor package is realized. CONSTITUTION: A lead frame raw material(110) is prepared. The photosensitive material(120)...

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Bibliographic Details
Main Authors EOM, SAI RAN, CHUN, HYUN A
Format Patent
LanguageEnglish
Korean
Published 29.09.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: The manufacturing method of multi-row lead frame and semiconductor package using the same minimizes the plating thickness at the plating pattern. The slimming of the semiconductor package is realized. CONSTITUTION: A lead frame raw material(110) is prepared. The photosensitive material(120) is spread in the lead frame raw material. The first pattern is formed after the exposure development process. The plating pattern(130) is formed into the formation of the first pattern in the lead frame raw material site exposing.
Bibliography:Application Number: KR20090022779