COMPONENT MOUNTING CONDITION DETERMINATION METHOD

• Main Authors: MAENISHI YASUHIRO, AWATA YOSHIAKI
• Format: Patent
• Language: English; Korean
• Published: 17.09.2010
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; CONTROL OR REGULATING SYSTEMS IN GENERAL; CONTROLLING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS; PHYSICS; PRINTED CIRCUITS; REGULATING; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

Provided is a component mounting condition determination method of a component mounter (200) that can improve a throughput of a whole production line. The method determines a mounting condition of the component mounter (200) that mounts components on boards, for use in a production line including the component mounter (200) including transportation lanes aligned parallel to each other. The method includes determining the mounting condition so that a line tact ratio among the transportation lanes approximates a predetermined ratio (S204 to S210).