COMPONENT MOUNTING CONDITION DETERMINATION METHOD

Provided is a component mounting condition determination method of a component mounter (200) that can improve a throughput of a whole production line. The method determines a mounting condition of the component mounter (200) that mounts components on boards, for use in a production line including th...

Full description

Saved in:
Bibliographic Details
Main Authors MAENISHI YASUHIRO, AWATA YOSHIAKI
Format Patent
LanguageEnglish
Korean
Published 17.09.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
PHYSICS
PRINTED CIRCUITS
REGULATING
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
Online AccessGet full text

Cover

More Information
Summary:Provided is a component mounting condition determination method of a component mounter (200) that can improve a throughput of a whole production line. The method determines a mounting condition of the component mounter (200) that mounts components on boards, for use in a production line including the component mounter (200) including transportation lanes aligned parallel to each other. The method includes determining the mounting condition so that a line tact ratio among the transportation lanes approximates a predetermined ratio (S204 to S210).
Bibliography:Application Number: KR20107011698