LIGHT EMITTING DIODE FOR MOUNTING TO A HEAT SINK

• Main Authors: WEEKAMP JOHANNES W, WALL FRANK J, STERANKA FRANK M, KMETEC JEFF, ZHANG LI
• Format: Patent
• Language: English; Korean
• Published: 03.09.2010
• Subjects: BLASTING; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; WEAPONS

A light emitting diode (LED) apparatus for mounting to a heat sink having a front surface with an opening therein is disclosed. The apparatus includes a sub-mount, at least one LED die mounted on the sub-mount, and a thermally conductive slug having first and second areas. The first area is thermally coupled to the sub-mount and the second area has a post protruding outwardly therefrom. The post is operably configured to be received in the opening in the heat sink and to secure the LED apparatus to the heat sink such that the second area is thermally coupled to the front surface of the heat sink. Other embodiments for mounting an LED apparatus utilizing adhesive thermally conductive material, spring clips, insertion snaps, or welding are also disclosed.