A FLUID SUPPLY SYSTEM, A LITHOGRAPHIC APPARATUS, A METHOD OF VARYING FLUID FLOW RATE AND A DEVICE MANUFACTURING METHOD

PURPOSE: A fluid supplying system, a lithography apparatus, a method for varying the flux of the fluid, and a method for manufacturing a device using the method are provided to constantly maintain a whole flow resistance with respect to the fluid in the downstream of fluid source, and vary the flux...

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Bibliographic Details
Main Authors KRAMER PIETER JACOB, MARTENS ARJAN HUBRECHT JOSEF ANNA, KUIJPER ANTHONIE
Format Patent
LanguageEnglish
Korean
Published 26.08.2010
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A fluid supplying system, a lithography apparatus, a method for varying the flux of the fluid, and a method for manufacturing a device using the method are provided to constantly maintain a whole flow resistance with respect to the fluid in the downstream of fluid source, and vary the flux of the fluid from fluid source with respect to a first component. CONSTITUTION: An illuminating system(IL) conditions radiation beam(B) and includes an adjustor(AD) which adjusts the angular intensity distribution of the radiation beam. A supporting structure(MT) supports a patterning device(MA). A substrate table(WT) is connected with a second position setting unit(PW). A projection system(PS) projects pattern, which is applied to the radiation beam, to the target part(C) of a substrate.
Bibliography:Application Number: KR20100013927