ELECTRIC DEVICE MODULE

• Main Authors: YOO, HYUN JUNG, SEO, DONG YOON, KIM, DO HYUNG, YANG, JUNG MO, PARK, IN YOUNG
• Format: Patent
• Language: English; Korean
• Published: 12.08.2010
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

PURPOSE: An electric element module is provided to be cost-effectively manufactured by reducing the number of layers required to supply signals to the electric element module. CONSTITUTION: A first contact-pad region(110) and a second contact-pad region(120) are arranged on both sides of a module board. The arrangement of both contact-pad regions has a mirror shape. The first contact-pad region and the second contact-pad region include a plurality of contact-pads(P11' to P16'). A first via region includes a plurality of vias(V1 to V6) which is formed between the first contact-pad region and the second contact-pad region.