CALL SETUP LATENCY REDUCTION BY ENCAPSULATING SIGNALLING MESSAGES
Techniques for minimizing call setup latency are disclosed. In one aspect, multiple signaling messages are encapsulated and sent as a single message thus reducing the total delay incurred by sequential transmission. In one embodiment, an encapsulation message includes a field indicating the number o...
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Main Authors | , , |
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Format | Patent |
Language | English Korean |
Published |
03.08.2010
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Subjects | |
Online Access | Get full text |
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Summary: | Techniques for minimizing call setup latency are disclosed. In one aspect, multiple signaling messages are encapsulated and sent as a single message thus reducing the total delay incurred by sequential transmission. In one embodiment, an encapsulation message includes a field indicating the number of messages encapsulated therein. In one example, the encapsulation is performed at a Link Access Control (LAC) layer. Alternate embodiments may perform encapsulation at an alternate layer. |
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Bibliography: | Application Number: KR20107013750 |