CALL SETUP LATENCY REDUCTION BY ENCAPSULATING SIGNALLING MESSAGES

Techniques for minimizing call setup latency are disclosed. In one aspect, multiple signaling messages are encapsulated and sent as a single message thus reducing the total delay incurred by sequential transmission. In one embodiment, an encapsulation message includes a field indicating the number o...

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Bibliographic Details
Main Authors WANG JUN, ACHOUR BAAZIZ, SINNARAJAH RAGULAN
Format Patent
LanguageEnglish
Korean
Published 03.08.2010
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Online AccessGet full text

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Summary:Techniques for minimizing call setup latency are disclosed. In one aspect, multiple signaling messages are encapsulated and sent as a single message thus reducing the total delay incurred by sequential transmission. In one embodiment, an encapsulation message includes a field indicating the number of messages encapsulated therein. In one example, the encapsulation is performed at a Link Access Control (LAC) layer. Alternate embodiments may perform encapsulation at an alternate layer.
Bibliography:Application Number: KR20107013750