PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT

PURPOSE: A package for an electronic device and an electronic component are provided to efficiently discharge heat from the electronic device by controlling the volume and cross section of a via. CONSTITUTION: A base substrate(2) is formed by laminating a plurality of ceramic sheets. A frame body(3)...

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Bibliographic Details
Main Authors YAMAKOSHI KIYOSHI, HONGO MASANORI, ITO HIDEKI, TAKAGI HIDEKI, HITOMI TAKUMA, FUKUYAMA MASAMI
Format Patent
LanguageEnglish
Korean
Published 30.07.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A package for an electronic device and an electronic component are provided to efficiently discharge heat from the electronic device by controlling the volume and cross section of a via. CONSTITUTION: A base substrate(2) is formed by laminating a plurality of ceramic sheets. A frame body(3) is arranged on the upper surface of the base substrate and has a cavity(3a) for receiving the electronic device. A via(4) is formed on the base substrate under the cavity and is filled with thermal conductive materials(5). A protrusion is protruded toward the center of the via and is formed on the inner wall of the via.
Bibliography:Application Number: KR20100006058