COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF COPPER CONDUCTOR WIRING AND MANUFACTURING METHOD THEREOF AND TREATMENT SOLUTION

• Main Authors: KUMASHIRO YASUSHI, NAKAKO HIDEO, MASUDA KATSUYUKI, YAMAMOTO KAZUNORI, EJIRI YOSHINORI, MACHII YOUICHI, YOKOZAWA SHUNYA
• Format: Patent
• Language: English; Korean
• Published: 27.07.2010
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CONDUCTORS; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution. 도전성 및 배선 패턴 형성이 뛰어나고, 배선폭 및 배선간 스페이스가 좁아져도, 회로간의 절연 저하가 없는 구리 도체막 및 그 제조방법 및 패터닝된 구리 도체 배선을 제공한다. 환원제에 대해서 촉매 활성을 가지는 금속과, 구리 산화물을 함께 함유하여 이루어지는 구리계 입자 함유층을, 하나의 용액 중에 구리 산화물을 이온화 또는 착체화하는 약제와, 구리 이온 또는 구리 착체를 환원하여 금속구리로 하는 환원제를 포함하는 처리액을 이용하여 처리하여 이루어지는 구리 도체막 및 그 제조방법 및 구리계 입자 함유층이 인쇄에 의해 패터닝되어 있고, 그 패터닝된 입자 함유층을 하나의 용액 중에 구리 산화물을 이온화 또는 착체화하는 약제와, 구리 이온 또는 구리 착체를 환원하여 금속구리로 하는 환원제를 함께 포함하는 용액을 이용한 처리방법에 의해 처리하여 얻어지는 패터닝된 구리 도체 배선이다.