METHOD AND APPARATUS FOR REPAIRING AN ELECTROSTATIC CHUCK DEVICE, AND THE ELECTROSTATIC CHUCK DEVICE

• Main Authors: YOSHIOKA KEN, SASAKI YASUHARU, TAKAHASHI SYUICHI
• Format: Patent
• Language: English; Korean
• Published: 22.07.2010
• Subjects: BASIC ELECTRIC ELEMENTS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERATION; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PURPOSE: An electrostatic chuck device and a method for repairing the same are provided to prevent the non-uniformity of thermal conductive of an adhesive layer after a repairing process by uniformly repairing the eroded absorbing layer and adhesive layer. CONSTITUTION: A wafer is absorbed on the upper side of an absorbing layer(23). The absorbing layer is made of an insulation resin sheet and ceramic with an electrode. A rotation unit(11) rotates an electrostatic chuck device(20). A bobbin(12) supplies a string type adhesive(14) to an adhesive layer(22). A position determining unit determines the position of the adhesive between a bobbin and the adhesive layer.