SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING OF METAL FILM

PURPOSE: A chemical mechanical polishing slurry composition for a metal film is provided to offer slurry without the surface defect, and to prevent the generating of a scratch with the improved slurry dispersion stability. CONSTITUTION: A chemical mechanical polishing slurry composition for a metal...

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Bibliographic Details
Main Authors KIM, SEOK JOO, HAN, DEOK SU, JEONG, EUN IL, PARK, HYU BUM
Format Patent
LanguageEnglish
Korean
Published 22.07.2010
Subjects
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
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Summary:PURPOSE: A chemical mechanical polishing slurry composition for a metal film is provided to offer slurry without the surface defect, and to prevent the generating of a scratch with the improved slurry dispersion stability. CONSTITUTION: A chemical mechanical polishing slurry composition for a metal film contains an abrasive, an organic compound having a carboxyl group, and amine or amino alcohol as a polishing speed enhancer. The abrasive is zeolite, fumed silica, colloid silica, alumina, ceria, zirconium oxide, titanium oxide, or their compound. The polishing speed enhancer is selected from the group consisting of diethylamine, monoethanolamine, diethanolamine, triethanolammine, hexylamine, propylamine, 3- aminopropanol, or their mixture.
Bibliography:Application Number: KR20090002895