MULTILAYER WIRING BOARD HAVING CAVITY SECTION

Provided is a multilayer wiring board wherein a plurality of wiring boards are laminated and a cavity is arranged. The multilayer wiring board is composed of a wiring board, which is arranged on the bottom surface of the cavity section when the multilayer wiring board is formed, and a wiring board a...

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Bibliographic Details
Main Authors MATSUI JUN, YAMADA SHINGETSU
Format Patent
LanguageEnglish
Korean
Published 02.07.2010
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Provided is a multilayer wiring board wherein a plurality of wiring boards are laminated and a cavity is arranged. The multilayer wiring board is composed of a wiring board, which is arranged on the bottom surface of the cavity section when the multilayer wiring board is formed, and a wiring board arranged closer to an upper layer compared with the wiring board. The wiring board and/or the wiring board is composed of an insulating base material having prescribed characteristics, and furthermore, the wiring board has a hole for the cavity. Thus, the multilayer wiring board, which has the cavity section and even a reflector function, is provided by using the multilayer wiring board having the cavity section.
Bibliography:Application Number: KR20107012104