WAFER TRANSPORTING SYSTEM, SEMICONDUCTOR FABRICATION PLANT STRUCTURE USING THE SAME AND WAFER TRANSPORTING METHOD

• Main Authors: SEO, SANG WON, KIM, JONG WOOK, HWANG, MOO SUNG
• Format: Patent
• Language: English; Korean
• Published: 01.07.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS

PURPOSE: A wafer transporting system, a semiconductor fabrication plant structure using the same, and a wafer transporting method are provided to minimize a space for installing semiconductor manufacturing equipment by forming a three dimensional multi-storied structure of a semiconductor fabrication plant. CONSTITUTION: A plurality of processing chamber modules(200) is formed on each layer of a multi-storied structure. An elevation channel(110) transfers vertically a wafer transferring box in which wafers are loaded. A semiconductor fabrication plant structure includes a wafer station(300) in order to load wafer cassettes into the wafer transferring box and unload the wafer cassettes from the wafer transferring box.