METAL-INSULATOR-METAL CAPACITOR FORMING METHOD FOR SEMICONDUCTOR DEVICE
PURPOSE: A MIM(Metal-insulator-metal) capacitor manufacturing method for a semiconductor device is provided to reduce the area of a chip and manufacture a reliable semiconductor by designing a MIM capacitor having an area corresponding to voltage generated for actual use. CONSTITUTION: A diffusion b...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
04.06.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A MIM(Metal-insulator-metal) capacitor manufacturing method for a semiconductor device is provided to reduce the area of a chip and manufacture a reliable semiconductor by designing a MIM capacitor having an area corresponding to voltage generated for actual use. CONSTITUTION: A diffusion barrier(120), a bottom conductive layer(130), and a dielectric layer(140) are formed on the semiconductor substrate, sequentially. The area of the dielectric layer applied with the high voltage is applied is patterned as a first photoresist(150). The dielectric layer for the low voltage is evaporated on the bottom conductive layer. |
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Bibliography: | Application Number: KR20080117341 |