MODULE, WIRING BOARD AND MODULE MANUFACTURING METHOD

A module is provided with a wiring board wherein a conductor pattern is formed on an insulating layer, and a functional element mounted with its face down on the conductor pattern through an electrode. An opening section is formed in a region, which is in the functional element mounting position of...

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Bibliographic Details
Main Authors NAKATANI YUSUKE, ITO SHOJI, TAKAMI RYO, OHMINATO TADANORI
Format Patent
LanguageEnglish
Korean
Published 31.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A module is provided with a wiring board wherein a conductor pattern is formed on an insulating layer, and a functional element mounted with its face down on the conductor pattern through an electrode. An opening section is formed in a region, which is in the functional element mounting position of the wiring board, is smaller than the projection surface of the functional element and is inside the portion where the electrode is bonded. A space between the functional element and the wiring board, and the opening section are sealed by a sealing resin.
Bibliography:Application Number: KR20107003273