METHOD OF FORMING COPPER WIRING PATTERN AND COPPER OXIDE PARTICLE DISPERSION FOR USE IN THE SAME

A method of forming a copper wiring pattern reduced in cracking and low in resistance from copper particles which are reduced in electromigration and which themselves have a low unit price. In the method, there is almost no need of using a surface-treating agent which has been essential for the anti...

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Main Authors KUMASHIRO YASUSHI, NAKAKO HIDEO, MASUDA KATSUYUKI, YAMAMOTO KAZUNORI, EJIRI YOSHINORI, MACHII YOUICHI, YOKOZAWA SHUNYA
Format Patent
LanguageEnglish
Korean
Published 28.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:A method of forming a copper wiring pattern reduced in cracking and low in resistance from copper particles which are reduced in electromigration and which themselves have a low unit price. In the method, there is almost no need of using a surface-treating agent which has been essential for the antioxidation and dispersion of copper particles. Also provided is a dispersion of copper oxide particles which is for use in the method. The method of forming a copper wiring pattern is characterized by comprising: a step in which a dispersion of copper particles each having a copper oxide surface is used to form any desired pattern on a substrate; and a step in which the copper oxide on the surface of the copper particles in the pattern is reduced to copper with atomic hydrogen and the copper metal particles generated by the reduction are sintered.
Bibliography:Application Number: KR20107008688