RECOVERABLE ELECTRONIC COMPONENT

PURPOSE: An electronic component is provided to remove an electronic device with a defect from an interconnection structure by heating a removable layer with a softening temperature or melting point. CONSTITUTION: A base insulation layer(10) includes a first surface and a second surface. An electron...

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Bibliographic Details
Main Authors FILLION RAYMOND ALBERT, MILLS RYAN CHRISTOPHER, ERLBAUM JEFFREY SCOTT, ESLER DAVID RICHARD, WOYCHIK CHARLES GERARD
Format Patent
LanguageEnglish
Korean
Published 27.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: An electronic component is provided to remove an electronic device with a defect from an interconnection structure by heating a removable layer with a softening temperature or melting point. CONSTITUTION: A base insulation layer(10) includes a first surface and a second surface. An electronic device includes a first surface and a second surface and is fixed to the basic insulation layer. A bonding layer(40) is arranged between the first surface of the electronic device and the second surface of the basic insulation layer. A removable layer is arranged between the first surface of the electronic device and the second surface of the basic insulation layer. The basic insulation layer is fixed to the electronic device through the removable layer and the removable layer releases the removable layer from the electronic device.
Bibliography:Application Number: KR20080115163