SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

PURPOSE: A semiconductor device and a method for manufacturing the same are provided to reduce the occupied area of the semiconductor device on substrates by stacking substrates in step shapes. CONSTITUTION: A plurality of semiconductor substrates includes connection electrode pads in pad formation...

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Bibliographic Details
Main Author DENDA ATSUSHI
Format Patent
LanguageEnglish
Korean
Published 20.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A semiconductor device and a method for manufacturing the same are provided to reduce the occupied area of the semiconductor device on substrates by stacking substrates in step shapes. CONSTITUTION: A plurality of semiconductor substrates includes connection electrode pads in pad formation regions. The connection electrode pads are electrically connected by stacking the semiconductor substrates. A relay electrode pad(RP) is connected to a lower semiconductor substrate by a relay wiring(RW). The relay electrode pad is exposed to an upper semiconductor substrate. The semiconductor substrates are mounted on a mounting substrate(10). The connection electrode pad of the lower semiconductor substrate is connected to the mounting electrode pad by a wiring.
Bibliography:Application Number: KR20090107420