POST-LAPPING CLEANING PROCESS AND APPARATUS FOR SEMICONDUCTOR WAFER

PURPOSE: A post-lapping cleaning method and an apparatus for cleaning a semiconductor wafer using the same are provided to automate a first cleaning process, a second process and a drying process by transferring a wafer. CONSTITUTION: A lapping process is performed for a semiconductor wafer. A first...

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Bibliographic Details
Main Authors NAM, BYUNG WOOK, CHANG, YU SIN
Format Patent
LanguageEnglish
Korean
Published 20.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PURPOSE: A post-lapping cleaning method and an apparatus for cleaning a semiconductor wafer using the same are provided to automate a first cleaning process, a second process and a drying process by transferring a wafer. CONSTITUTION: A lapping process is performed for a semiconductor wafer. A first cleaning process for the wafer is performed in a cleaning bath in which deionized water-contained cleaning solution(t1). A second cleaning process for the wafer is performed with a roll brush and a two-fluid nozzle(t2). The wafer is dried(t3). The first cleaning process and the second cleaning process and the dry process are automatically performed by transferring the wafer.
Bibliography:Application Number: KR20080111693