EQUIPMENT FOR WIRE BONDING OF SEMICONDUCTOR
PURPOSE: A wire-bonding machine for a semiconductor is provided to simplify manufacturing operation processes by automatically changing loop related-parameters if the loop-shape of a wire is changed. CONSTITUTION: A bonding pad(100) of a die and a lead frame(110) in a semiconductor package are conne...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Korean |
Published |
20.05.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A wire-bonding machine for a semiconductor is provided to simplify manufacturing operation processes by automatically changing loop related-parameters if the loop-shape of a wire is changed. CONSTITUTION: A bonding pad(100) of a die and a lead frame(110) in a semiconductor package are connected by a wire(120). The monitor of a wire-bonding machine detects whether the loop-shape of the wire is changed. In response with the changed loop-shape of the wire, loop related parameters of the machine are changed. The change of the loop-shape is controlled by a mouse, a control button and a touch screen. |
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Bibliography: | Application Number: KR20080111620 |