RESIN SOLUTION FOR THERMAL IMPRINT, RESIN THIN FILM FOR THERMAL IMPRINT, METHODS FOR PRODUCTION OF THE RESIN SOLUTION AND THE RESIN THIN FILM

Disclosed are: a resin solution substantially applicable to a thermal imprint process; a thin film produced from the resin solution; a method for producing the resin solution; and a method for producing the thin film. Specifically disclosed is a resin solution for thermal imprint, which is intended...

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Bibliographic Details
Main Authors NAGAI GO, MITRA ANUPAM, KUSUURA TAKAHISA, TAKAYA YOSHIAKI, HAYASHIDA YOSHIHISA, SATSUKA TAKURO
Format Patent
LanguageEnglish
Korean
Published 13.05.2010
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Summary:Disclosed are: a resin solution substantially applicable to a thermal imprint process; a thin film produced from the resin solution; a method for producing the resin solution; and a method for producing the thin film. Specifically disclosed is a resin solution for thermal imprint, which is intended to be used for forming a thin film for thermal imprint. The resin solution comprises a thermoplastic resin and at least one solvent capable of dissolving the resin, and is so prepared as to contain foreign matters each having a particle size of 0.2 μm or larger in an amount of less than 3000 particles/cm. A thin film is formed from the resin solution, and is so prepared as to have a residual volatile content of 0.25% or less.
Bibliography:Application Number: KR20107002435