NON-SINTERED MULTI-LAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD OF NON-SHRINKING MULTI-LAYER CERAMIC SUBSTRATE

PURPOSE: A non-sintered multilayer ceramic substrate and a method for manufacturing a non-shrinking multilayer substrate are provided to suppress the protrusion of a via electrode by forming a via electrode inside a via hole through an aerosol deposition method. CONSTITUTION: A ceramic laminate(210)...

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Bibliographic Details
Main Authors CHO, BEOM JOON, LEE, JONG MYEON
Format Patent
LanguageEnglish
Korean
Published 03.05.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: A non-sintered multilayer ceramic substrate and a method for manufacturing a non-shrinking multilayer substrate are provided to suppress the protrusion of a via electrode by forming a via electrode inside a via hole through an aerosol deposition method. CONSTITUTION: A ceramic laminate(210) is comprised of a ceramic green sheet(201), a polymer resin layer(205), and a via electrode. At least one via hole(203) is formed on the ceramic green sheet. The polymer resin layer is formed on one side of the ceramic green sheet. The via electrode is formed inside the via hole. The via electrode is made of conductive metal powder. The height of the via electrode is lower than the height of the via hole. A green sheet(230) for suppressing the shrinkage is arranged on one side or both sides of the ceramic laminate.
Bibliography:Application Number: KR20080104466