ALKALINE AQUEOUS SOLUTION COMPOSITION FOR TREATING A SUBSTRATE

PURPOSE: An alkaline aqueous solution composition for treating a substrate is provided to prevent metal adsorption on the surface of a substrate in an etching process or cleansing process using a strong alkaline solution, and to improve electrical properties of a semiconductor device or electron dev...

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Bibliographic Details
Main Authors ISHIKAWA NORIO, MORITA KIKUE
Format Patent
LanguageEnglish
Korean
Published 19.04.2010
Subjects
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
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Summary:PURPOSE: An alkaline aqueous solution composition for treating a substrate is provided to prevent metal adsorption on the surface of a substrate in an etching process or cleansing process using a strong alkaline solution, and to improve electrical properties of a semiconductor device or electron device. CONSTITUTION: An alkaline aqueous solution composition for treating a substrate comprises an alkaline component, and one or more chelating agents selected from the group consisting of dihydroxyethyl glycine, 3-hydroxy-2,2'-iminodisuccinic acid, serine and salts thereof. The alkaline component is sodium hydroxide or potassium hydroxide, which is used for etching or cleaning of a silicon wafer. The concentration of sodium hydroxide or potassium hydroxide is 10-50% by weight, and the concentration of the chelating agent is 0.001-1.0% by weight, which is used for etching of a silicon wafer.
Bibliography:Application Number: KR20090095412