SEMICONDUCTOR APPARATUS, SUBSTRATE DESIGN METHOD, AND SUBSTRATE DESIGN APPARATUS

PURPOSE: A semiconductor apparatus, a substrate design method and a substrate design apparatus are provided to reduce the stress and the distortion to an electrode which is arranged on the peripheral of a chip by forming through holes. CONSTITUTION: A semiconductor apparatus includes a substrate(12)...

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Bibliographic Details
Main Authors MATSUI NORIYUKI, SAKAI HIDEHISA
Format Patent
LanguageEnglish
Korean
Published 08.04.2010
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A semiconductor apparatus, a substrate design method and a substrate design apparatus are provided to reduce the stress and the distortion to an electrode which is arranged on the peripheral of a chip by forming through holes. CONSTITUTION: A semiconductor apparatus includes a substrate(12) and a semiconductor chip which is loaded on the substrate. A plurality of through holes(21a) are arranged on the substrate. The region of the substrate which is adjacent to the peripheral of a semiconductor chip is a first region. The number of through holes in the first region is more concentrated than the other region of the substrate.
Bibliography:Application Number: KR20090091699