INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING

A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring. Advantageously, the tin-copper-alloy layer inhibits copper dissolution during a solder reflow process because...

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Bibliographic Details
Main Authors DELUCCA JOHN M, OSENBACH JOHN W, AMIN AHMED, XIONG ZHENGPENG, BACHMAN MARK ADAM, BAIOCCHI FRANK A
Format Patent
LanguageEnglish
Korean
Published 02.04.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring. Advantageously, the tin-copper-alloy layer inhibits copper dissolution during a solder reflow process because that layer is substantially insoluble in liquid Sn-Ag-Cu (tin-silver-copper) solder alloys under typical solder reflow conditions and therefore shields the copper plating from direct physical contact with the liquefied solder.
Bibliography:Application Number: KR20107001864