SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER
A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English Korean |
Published |
01.04.2010
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die. |
---|---|
Bibliography: | Application Number: KR20107001950 |