PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE PACKAGE SUBSTRATE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

PURPOSE: A manufacturing method of semiconductor package and a semiconductor package having a package substrate, and a package substrate secludes the movement of the molding material facing from a clamping area to a built-in region. The formation of the void is prevented within the molding material....

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Bibliographic Details
Main Authors LEE, JEONG SAM, KWAK, YONG IL, JANG, JONG KAK, CHOI, JUN HYUK
Format Patent
LanguageEnglish
Korean
Published 26.03.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A manufacturing method of semiconductor package and a semiconductor package having a package substrate, and a package substrate secludes the movement of the molding material facing from a clamping area to a built-in region. The formation of the void is prevented within the molding material. CONSTITUTION: A package substrate(100) comprises an insulating substrate, and a circuit pattern and insulating member. With a built-in region in which in an insulating substrate(110), the outer connector is mounted. The clamped clamping area is had in the mold die used for a molding progress of using a molding material. The circuit pattern(120) is formed in the insulating substrate. The insulating member is included in the clamping area. Adhere closely to the mold die and the insulating member secludes that the molding material penetrates within the built-in region.
Bibliography:Application Number: KR20080091490