CURABLE RESIN COMPOSITION, SET FOR FORMING RESIN CURED FILM, PROTECTIVE FILM AND PROCESS FOR FORMING PROTECTIVE FILM

PURPOSE: A curable resin composition is provided to form a curable film with excellent flatness, to ensure high transparency and surface hardness, heat resistance and pressure resistance, and excellent alkali resistance and anti-sputtering property. CONSTITUTION: A curable resin composition comprise...

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Bibliographic Details
Main Authors TANIMOTO KANAKO, UEDA JIROU, FUJIOKA MASAYASU, IIJIMA TAKAHIRO
Format Patent
LanguageEnglish
Korean
Published 15.03.2010
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE: A curable resin composition is provided to form a curable film with excellent flatness, to ensure high transparency and surface hardness, heat resistance and pressure resistance, and excellent alkali resistance and anti-sputtering property. CONSTITUTION: A curable resin composition comprises (A) a polymer having a repeating unit derived from a polymerizable unsaturated compound with an oxyranyl group or oxetanyl group, and (B) polyorganosiloxane represented by chemical formula 1. In chemical formula 1, R^1~R^6 are independently a group represented by chemical formula 2, hydrogen atom, C1~4 alkoxy group, C3~8 cycloalkyloxy group or phenoxy group; and n is an integer of 2~30.
Bibliography:Application Number: KR20090081925