CAMERA MODULE MANUFACTURING METHOD FOR PREVENTING FOREIGN SUBSTANCE

PURPOSE: A camera module manufacturing method for preventing foreign substances is provided to coat a protective film with polymer material on a micro lens unit in a wafer state which is a previous step of a camera module package process, thereby efficiently preventing foreign substances. CONSTITUTI...

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Main Author KIM, JUNG JIN
Format Patent
LanguageEnglish
Korean
Published 10.03.2010
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
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Abstract PURPOSE: A camera module manufacturing method for preventing foreign substances is provided to coat a protective film with polymer material on a micro lens unit in a wafer state which is a previous step of a camera module package process, thereby efficiently preventing foreign substances. CONSTITUTION: A camera module manufacturing method for preventing foreign substances comprises the following steps: a step of forming a protective film to cover a micro lens in the wafer state of an image sensor chip(S110); a wafer dicing step of dicing each image sensor chip from a wafer(S120); a die bonding step of installing an image sensor chip on a circuit board(S130); a wire bonding step of bonding an image sensor chip on a circuit board(S140); a step of removing the protective film(S150); a step of housing and lens assembling in which a housing and a lens are installed(S160).
AbstractList PURPOSE: A camera module manufacturing method for preventing foreign substances is provided to coat a protective film with polymer material on a micro lens unit in a wafer state which is a previous step of a camera module package process, thereby efficiently preventing foreign substances. CONSTITUTION: A camera module manufacturing method for preventing foreign substances comprises the following steps: a step of forming a protective film to cover a micro lens in the wafer state of an image sensor chip(S110); a wafer dicing step of dicing each image sensor chip from a wafer(S120); a die bonding step of installing an image sensor chip on a circuit board(S130); a wire bonding step of bonding an image sensor chip on a circuit board(S140); a step of removing the protective film(S150); a step of housing and lens assembling in which a housing and a lens are installed(S160).
Author KIM, JUNG JIN
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Snippet PURPOSE: A camera module manufacturing method for preventing foreign substances is provided to coat a protective film with polymer material on a micro lens...
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SubjectTerms ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
Title CAMERA MODULE MANUFACTURING METHOD FOR PREVENTING FOREIGN SUBSTANCE
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