CAMERA MODULE MANUFACTURING METHOD FOR PREVENTING FOREIGN SUBSTANCE
PURPOSE: A camera module manufacturing method for preventing foreign substances is provided to coat a protective film with polymer material on a micro lens unit in a wafer state which is a previous step of a camera module package process, thereby efficiently preventing foreign substances. CONSTITUTI...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English Korean |
Published |
10.03.2010
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PURPOSE: A camera module manufacturing method for preventing foreign substances is provided to coat a protective film with polymer material on a micro lens unit in a wafer state which is a previous step of a camera module package process, thereby efficiently preventing foreign substances. CONSTITUTION: A camera module manufacturing method for preventing foreign substances comprises the following steps: a step of forming a protective film to cover a micro lens in the wafer state of an image sensor chip(S110); a wafer dicing step of dicing each image sensor chip from a wafer(S120); a die bonding step of installing an image sensor chip on a circuit board(S130); a wire bonding step of bonding an image sensor chip on a circuit board(S140); a step of removing the protective film(S150); a step of housing and lens assembling in which a housing and a lens are installed(S160). |
---|---|
Bibliography: | Application Number: KR20080085796 |