SEMICONDUCTOR DEVICE AND CIRCUIT BOARD ASSEMBLY
PURPOSE: A semiconductor device and a circuit board assembly are provided to reduce changes in combination units by configuring the width of a band of a combination inhibition area to be wider than the space between the combination units. CONSTITUTION: A device fixing substrate(32) includes a surfac...
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| Main Authors | , |
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| Format | Patent |
| Language | English Korean |
| Published |
08.03.2010
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| Subjects | |
| Online Access | Get full text |
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| Abstract | PURPOSE: A semiconductor device and a circuit board assembly are provided to reduce changes in combination units by configuring the width of a band of a combination inhibition area to be wider than the space between the combination units. CONSTITUTION: A device fixing substrate(32) includes a surface(F) and a rear side(B). A semiconductor device(31) is fixed on the surface of the device fixing substrate. A plurality of combination units(33) is arranged on the rear side of the device fixing substrate. The combination units include pads(33A) formed on the rear side of the device fixing substrate and solder balls(33B) formed on the pads. The combination units combine a circuit board and the device fixing board. The combination units are arranged at a constant interval. |
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| AbstractList | PURPOSE: A semiconductor device and a circuit board assembly are provided to reduce changes in combination units by configuring the width of a band of a combination inhibition area to be wider than the space between the combination units. CONSTITUTION: A device fixing substrate(32) includes a surface(F) and a rear side(B). A semiconductor device(31) is fixed on the surface of the device fixing substrate. A plurality of combination units(33) is arranged on the rear side of the device fixing substrate. The combination units include pads(33A) formed on the rear side of the device fixing substrate and solder balls(33B) formed on the pads. The combination units combine a circuit board and the device fixing board. The combination units are arranged at a constant interval. |
| Author | SAKAI HIDEHISA MATSUI NORIYUKI |
| Author_xml | – fullname: MATSUI NORIYUKI – fullname: SAKAI HIDEHISA |
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| Notes | Application Number: KR20090061239 |
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| RelatedCompanies | FUJITSU LIMITED |
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| Snippet | PURPOSE: A semiconductor device and a circuit board assembly are provided to reduce changes in combination units by configuring the width of a band of a... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SEMICONDUCTOR DEVICE AND CIRCUIT BOARD ASSEMBLY |
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