SEMICONDUCTOR DEVICE AND CIRCUIT BOARD ASSEMBLY

PURPOSE: A semiconductor device and a circuit board assembly are provided to reduce changes in combination units by configuring the width of a band of a combination inhibition area to be wider than the space between the combination units. CONSTITUTION: A device fixing substrate(32) includes a surfac...

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Bibliographic Details
Main Authors MATSUI NORIYUKI, SAKAI HIDEHISA
Format Patent
LanguageEnglish
Korean
Published 08.03.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A semiconductor device and a circuit board assembly are provided to reduce changes in combination units by configuring the width of a band of a combination inhibition area to be wider than the space between the combination units. CONSTITUTION: A device fixing substrate(32) includes a surface(F) and a rear side(B). A semiconductor device(31) is fixed on the surface of the device fixing substrate. A plurality of combination units(33) is arranged on the rear side of the device fixing substrate. The combination units include pads(33A) formed on the rear side of the device fixing substrate and solder balls(33B) formed on the pads. The combination units combine a circuit board and the device fixing board. The combination units are arranged at a constant interval.
Bibliography:Application Number: KR20090061239