SUBSTRATE PROCESSING APPARATUS AND MEMBER EXPOSED TO PLASMA

• Main Authors: YAMASHITA JUN, UEDA ATSUSHI, MURAOKA SUNAO
• Format: Patent
• Language: English
• Published: 04.02.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A substrate placing table is provided with a substrate placing table main body, which has a heater embedded inside and has the surface for heating a substrate to be processed; and a lifter pin inserted movably in the vertical direction in the substrate placing table. On the heating surface of the substrate placing table main body, a recessed section having a bottom surface lower than the heating surface is formed corresponding to the lifter pin. The lifter pin is provided with a lifter pin main body, and a head section, which is formed corresponding to the recessed section at the leading end portion of the lifter pin main body, can be partially stored in the recessed section and has a diameter larger than that of the lifter pin main body. The head section is provided with a head section upper edge for supporting the substrate to be processed, and a head section lower surface facing the head section upper edge. The lifter pin can freely shift between a first status where the lower surface of the head section is engaged with the bottom surface of the recessed section, and a second status where the lower surface of the head section is risen from the bottom surface of the recessed section.