CONTACT STRUCTURES IN A SUBSTRATE HAVING A BONDED INTERFACE, SEMICONDUCTOR DEVICES INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

PURPOSE: A contact structures in a substrate having a bonded interface, a semiconductor device including the same, and a method of fabricating the same are provided to prevent bonded interface of the conductive material of a contact plug as the bonded interface between the lower insulating layer and...

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Main Authors RAH, YOUNG SEOP, JANG, YOUNG CHUL, JUNG, SOON MOON, SON, YANG SOO, KIM, HAN SOO, SONG, MIN SUNG, CHO, WON SEOK, KIM, JONG HYUK
Format Patent
LanguageEnglish
Published 29.01.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A contact structures in a substrate having a bonded interface, a semiconductor device including the same, and a method of fabricating the same are provided to prevent bonded interface of the conductive material of a contact plug as the bonded interface between the lower insulating layer and an upper substrate is apart from a contact plug. CONSTITUTION: A lower insulating layer(166) is formed on a lower plate(151). The upper plate is formed on the lower insulating layer. A groove is extended to the inside of the lower insulating layer. The groove has a bottom surface which is lower than the interface between the lower insulating layer and the upper plate. The upper isolating layer(211) is formed in order to fill the groove. The contact plug is extended to the inside of the lower insulating layer.
Bibliography:Application Number: KR20080070716