POLISHING PAD DRESSING UNIT

PURPOSE: A polishing pad dressing unit is provided to prevent the degradation of the evenness of wafer in the wafer polishing. CONSTITUTION: The dressing unit for polishing pad(300) for the grinding pad includes a pair of tables, and a pair of grinding pads and carrier holder(40). A pair of grinding...

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Bibliographic Details
Main Authors JUNG, HEE HYUN, YU, HWAN SU, SONG, HYUN JIN
Format Patent
LanguageEnglish
Published 25.01.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A polishing pad dressing unit is provided to prevent the degradation of the evenness of wafer in the wafer polishing. CONSTITUTION: The dressing unit for polishing pad(300) for the grinding pad includes a pair of tables, and a pair of grinding pads and carrier holder(40). A pair of grinding pads polishes the wafer. Wafer is supported in the carrier holder. The carrier for dresser(210) is combined in the carrier holder. Three dressers(220) has the each same outer shape. Three dressers is the circle shape. Three dressers perform the dressing of the grinding pad with the rubbing with the grinding pad.
Bibliography:Application Number: KR20080068519