PREHEATING APPARATUS FOR RESIN MOLDING SYSTEM

PURPOSE: A pre-heating device for a semiconductor device resin molding system is provided to improve production yield by preventing damage to the semiconductor device. CONSTITUTION: A pre-heating device for a semiconductor device resin molding system comprises a pre-heating plate(320), a detecting s...

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Bibliographic Details
Main Author CHOI, IL RAK
Format Patent
LanguageEnglish
Published 06.01.2010
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:PURPOSE: A pre-heating device for a semiconductor device resin molding system is provided to improve production yield by preventing damage to the semiconductor device. CONSTITUTION: A pre-heating device for a semiconductor device resin molding system comprises a pre-heating plate(320), a detecting sensor, and a control part. A semiconductor device is settled on the pre-heating plate, and then preheated. The detecting sensor detects whether existence of the semiconductor device loaded on the pre-heating plate or not. The control part stops the pre-heating device according to the detected result of the detecting sensor, and then reactivates.
Bibliography:Application Number: KR20080060118