PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER

A process is described that enables the active side of a bumped wafer to be coated with a front side protection (FSP) material or wafer level underfill (WLUF) without contaminating the solder bumps with the coating material and/or filler. In this process a repellent material is applied to a top port...

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Bibliographic Details
Main Authors WYATT DEREK, DUTT GYAN, PEREZ ALBERT P
Format Patent
LanguageEnglish
Published 25.09.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A process is described that enables the active side of a bumped wafer to be coated with a front side protection (FSP) material or wafer level underfill (WLUF) without contaminating the solder bumps with the coating material and/or filler. In this process a repellent material is applied to a top portion of the solder bumps on the active side of the wafer, the front side of the wafer is then coated with the coating material, the coating material is hardened, and optionally the repellent material is removed from the solder bumps.
Bibliography:Application Number: KR20087031951