METHOD OF MANUFACTURING FOR DISPLAY DEVICE

A method for manufacturing a display device is provided to mount a direct driver IC chip on a plastic substrate, stably without the crack on a pad. A carrier substrate is prepared. A plastic substrate is formed on the carrier substrate. A thin film transistor(101), a pixel electrode(180) and a conne...

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Bibliographic Details
Main Authors CHOI, JEONG YE, HONG, WANG SU
Format Patent
LanguageEnglish
Korean
Published 09.09.2009
Subjects
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Summary:A method for manufacturing a display device is provided to mount a direct driver IC chip on a plastic substrate, stably without the crack on a pad. A carrier substrate is prepared. A plastic substrate is formed on the carrier substrate. A thin film transistor(101), a pixel electrode(180) and a connection pad are formed on the plastic substrate. So as to be electrically connected with the connection pad, a driver IC chip on the plastic substrate. The plastic substrate is separated from the carrier substrate and includes a sacrificial layer which comes in contact with the carrier substrate and a main body layer which is formed on the sacrificial layer.
Bibliography:Application Number: KR20080020088