EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

• Main Authors: KOTANI TAKAHIRO, NISHITANI YOSHINORI, OKA DAISUKE
• Format: Patent
• Language: English; Korean
• Published: 30.07.2009
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Disclosed is an epoxy resin composition for semiconductor encapsulation, which contains an epoxy resin (A) including specific three kinds of epoxy resins (a1)-(a3). The epoxy resin composition for semiconductor encapsulation is characterized in that it has a spiral flow as measured according to EMMI-1-66 of not less than 80 cm, and a cured product thereof has a glass transition temperature of not less than 150°C and a linear expansion coefficient of not less than 5 ppm/°C but not more than 10 ppm/°C at a temperature not more than the glass transition temperature thereof.