METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD HAVING EMBEDDED CHIP AND PRINTED CIRCUIT BOARD HAVING AN EMBEDDED CHIP USING THE SAME

• Main Authors: CHOI, YOUN HO, CHO, SHIN HEE, KIM, SANG HYUN, SEO, HO SEONG, JUNG, JI HYUN, CHO, SHI YUN, LEE, YOUNG MIN
• Format: Patent
• Language: English; Korean
• Published: 22.07.2009
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A method for manufacturing a printed circuit board having an embedded chip and a printed circuit board having an embedded chip manufactured thereby are provided to radiate easily the heat to the outside in a driving state of two or more semiconductor chips embedded in a printed circuit board. A plurality of reception holes(110) are formed at a metal core. The reception holes are formed through an etch process. A semiconductor chip(200) is loaded on each of the reception holes. An electrode is formed at each of the reception holes. An insulating layer(300) is formed simultaneously on an upper surface and a lower surface of the metal core. A circuit pattern(310) is formed on an external surface of the insulating layer. The circuit pattern formed on the external surface of the insulating layer is electrically connected with the electrodes.