HEAT SINK

A heat sink is provided to cool uniformly a cooling plate and to obtain excellent cooling efficiency by installing a cooling fan in a cooling space having multiple layers. A heat sink(100) includes a cooling plate(110), a cooling unit(120), and a heat pipe(130). The cooling plate is formed by lamina...

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Main Authors LEE, BYUBG JOO, GU, YUN JIN, YEOM, JIN, CHOI, JIN HONG, NA, SUK JOO, KIM, SUNG JIN, WOO, SI WOONG, CHOI, HO SUN, KIM, DONG KWON, SONG, IN CHEON
Format Patent
LanguageEnglish
Published 20.07.2009
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A heat sink is provided to cool uniformly a cooling plate and to obtain excellent cooling efficiency by installing a cooling fan in a cooling space having multiple layers. A heat sink(100) includes a cooling plate(110), a cooling unit(120), and a heat pipe(130). The cooling plate is formed by laminating a plurality of layers. A cooling space(111) is formed between the laminated layers. A penetrating hole(112) is formed at a center of the cooling plate in order to receive external air. The cooling unit includes a plurality of cooling fans(123) which are installed in an outer circumference of a central shaft(122) for receiving driving force of a motor(121) the penetrating hole of the cooling plate. The cooling fans are rotated in a circular direction in the cooling space. The heat pipe penetrates peripheries of the cooling plates in a vertical direction. The heat pipe is connected to a radiating block attached to an electronic component in order to radiate the temperature of the radiating block to the outside by using the internal evaporation heat.
Bibliography:Application Number: KR20080004551